• CDT-1000
    • The thermal conductivity of diamond is 1000～2000 w/m.k, which is the highest among all the materials. It is 3 to 5 times than that of copper. Meanwhile, diamond has a small thermal expansion coefficient. So it can largely improve the radiating efficiency by depositing diamond films on common heat sink materials such as Cu and Mo. High-power laser diodes and MCMs (multi-chip three-dimensional assembly technology) are the two main thermal application fields of CVD diamond films.
      In this field, the performance of existing heat sink materials can not compete to that of diamond films. The thermal conductivity of the moderate heat sink diamond films can achieve 2-3 times than that of Cu in the room temperature, which is much higher than those of the materials used at present such as AlN, Cu-W alloy, Al2O3 and BeO. It is only inferior to the nature Ⅱa and the Ⅰb synthesized under high pressure high-quality single crystal diamond.
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      Typical Specification of CDT-1000 Diamond Films Heat Spreader
      TThermal Conductivity (w/m.k) >1000
      Surface Roughness (Ra.nm) <200
      Surface Flatness (μm/mm) 0.5
      Thickness (μm) 200,300,500
      Length of Side (mm) 0.5-50